S819-300-40-200

The Half Dome Series

Plate Fin Heat Sinks for Low to Medium Airflow

300 X 200 X 40.0 mm

 

Features and Benefits

  • Plate fin heat sinks are manufactured by extrusion using highly conductive aluminum alloy 6063-T5, which has great mechanical and thermal properties.
  • The tooling and unit costs of extrusion are among the lowest of all mass-production methods.
  • Extruded aluminum heat sinks can be easily customized with excellent surface finish and appearance.
  • To improve thermal radiation, heat sinks can be anodized to black or other colors.
  • Length can be customized (without increasing costs).
S819-300-40-200 Plate Fin Heat Sinks for Low to Medium Airflow

Mechanical Drawing

Mechanical Drawing of Plate Fin Heat Sinks for Low to Medium Airflow

Thermal Performance Curve

Thermal Performance of Plate Fin Heat Sinks for Low to Medium Airflow

Mechanical and Thermal Specifications

PropertyValueUnit
Width300.0mm
Length200.0mm
Height40.0mm
Weight3076.5g
θSA (natural)1.15°C/W
θSA (200 LFM)0.12°C/W
θSA (400 LFM)0.09°C/W
θSA (600 LFM)0.07°C/W
θSA (800 LFM)0.06°C/W

Thermal Interface Material and Attachment Method

  • We recommend thermal grease and phase change materials when mechanical hardware is used to attach this heat sink to a device.
  • Thermal tapes such as 3M 8810 and MHS T302 can be used when mechanical hardware is not available.
  • When this heat sink is used to cool multiple devices, compressible thermal pads are recommended.
  • For other attachment methods and TIMs, please contact us.
What is the thermal resistance (θSA)?
Airflow rate:
What will be the base temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
What will be the junction temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
TIM impedance:
θjc: °C/W
* The computation is based on the interpolation of experimental or simulation data, and the result is for reference only.
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