S807-125-95-30

The Great Lakes Series

Precision Forged Round Pin Heat Sink

125 X 95 X 30.0 mm

 

Features and Benefits

  • Designed for low-airflow environment (good for natural convection, limited airflow, fan failure, highly populated PCB, etc.)
  • Forged from highly conductive pure aluminum (240 W/m-K)
  • Omni-directional (allowing air to come from any direction)
  • Low pressure drop (improving downstream velocity and temperature fields)
  • Overall height can be customized (without increasing cost)
  • Secondary operation available (to modify shape, add holes, eliminate or shorten certain pins, etc.)
  • RoHS and REACH compliant
  • Cost effective
S807-125-95-30 Precision Forged Round Pin Heat Sink

Mechanical Drawing

Mechanical Drawing of Precision Forged Round Pin Heat Sink

Thermal Performance Curve

Thermal Performance of Precision Forged Round Pin Heat Sink

Mechanical and Thermal Specifications

PropertyValueUnit
Width125.0mm
Length95.0mm
Height30.0mm
Weight213.1g
θSA (natural)2.60°C/W
θSA (200 LFM)0.30°C/W
θSA (400 LFM)0.19°C/W
θSA (600 LFM)0.15°C/W
θSA (800 LFM)0.13°C/W

Thermal Interface Material and Attachment Method

  • S807 series is designed to work with many attachment methods, including captive screws, push pins and double-sided thermal tapes.
  • Captive screws (made of stainless steel) provide the most secure attachment and are recommended for large and heavy heat sinks.
  • Push pins (made of spring steel or nylon) provide a convenient way to install heat sinks to printed circuit boards.
  • Double-sided thermal tapes provide strong adhesion between heat sinks and devices. Because of their relatively high thermal resistance, we only recommend thermal tapes on cost-sensitive projects.
  • When captive screws and push pins are used, we recommend phase change materials, such as Chomerics T7xx and Laird Tpcm series, as the thermal interface materials (TIM).
What is the thermal resistance (θSA)?
Airflow rate:
What will be the base temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
What will be the junction temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
TIM impedance:
θjc: °C/W
* The computation is based on the interpolation of experimental or simulation data, and the result is for reference only.
© 2021 MyHeatSinks, Inc. All Rights Reserved.