S805-100-50-30

The Woodlands Series

Precision Forged Round Pin Heat Sink

100 X 50 X 30.0 mm

 

Features and Benefits

  • Designed for medium- to high-airflow environment (200-1000 LFM, or 1.0-5.0 m/sec)
  • Forged from highly conductive pure aluminum (240 W/m-K)
  • Low pressure drop (improving downstream velocity and temperature fields)
  • Overall height can be customized (without increasing cost)
  • Secondary operation available (to modify shape, add holes, eliminate or shorten certain pins, etc.)
  • RoHS and REACH compliant
  • Cost effective
S805-100-50-30 Precision Forged Round Pin Heat Sink

Mechanical Drawing

Mechanical Drawing of Precision Forged Round Pin Heat Sink

Thermal Performance Curve

Thermal Performance of Precision Forged Round Pin Heat Sink

Mechanical and Thermal Specifications

PropertyValueUnit
Width100.0mm
Length50.0mm
Height30.0mm
Weight144.0g
θSA (natural)0.21°C/W
θSA (200 LFM)0.14°C/W
θSA (400 LFM)0.11°C/W
θSA (600 LFM)0.09°C/W
θSA (800 LFM)0.09°C/W

Thermal Interface Material and Attachment Method

  • S805 series is designed to work with many attachment methods, including captive screws, push pins and double-sided thermal tapes.
  • Captive screws (made of stainless steel) provide the most secure attachment and are recommended for large and heavy heat sinks.
  • Push pins (made of spring steel or nylon) provide a convenient way to install heat sinks to printed circuit boards.
  • We recommend using double-sided thermal tapes, thermal epoxy or mechanical clips to attach this heat sink to device.
  • We recommend Chomerics T412 or 3M 8810 as the double-sided thermal tapes.
What is the thermal resistance (θSA)?
Airflow rate:
What will be the base temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
What will be the junction temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
TIM impedance:
θjc: °C/W
* The computation is based on the interpolation of experimental or simulation data, and the result is for reference only.
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