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S804-190L-145
The Kings Peak Series
Elliptical Pin Heat Sink with Push Pins
19 X 19 X 14.5 mm
Features and Benefits
- Designed for medium- to high-airflow environment (200-1000 LFM, or 1.0-5.0 m/sec)
- Forged from highly conductive pure aluminum (240 W/m-K)
- Secure attachment to PCB using push pins or shoulder screws
- Low pressure drop (improving downstream velocity and temperature fields)
- Overall height can be customized (without increasing cost)
- Secondary operation available (to modify shape, add holes, eliminate or shorten certain pins, etc.)
- RoHS compliant
- Cost effective
Mechanical Drawing
Thermal Performance Curve
Mechanical and Thermal Specifications
| Property | Value | Unit |
|---|---|---|
| Width | 19.0 | mm |
| Length | 19.0 | mm |
| Height | 14.5 | mm |
| Weight | 5.6 | g |
| θSA (natural) | 20.95 | °C/W |
| θSA (200 LFM) | 7.32 | °C/W |
| θSA (400 LFM) | 5.38 | °C/W |
| θSA (600 LFM) | 4.16 | °C/W |
| θSA (800 LFM) | 3.75 | °C/W |
Thermal Interface Material and Attachment Method
- We recommend using spring-loaded push pins or shoulder screws to secure the heat sink to device.
- We recommend Chomerics T725, T557 or Laird Tpcm 585 as interface materials.
What is the thermal resistance (θSA)?
What will be the base temperature?
What will be the junction temperature?