S802-5000-279

The Clear Lake Series

Round Pin Heat Sink with Push Pins

50 X 50 X 27.9 mm

 

Features and Benefits

  • Designed for low- to medium-airflow environment (good for natural convection, limited airflow, fan failure, highly populated PCB, etc.)
  • Forged from highly conductive pure aluminum (240 W/m-K)
  • Secure attachment to PCB using push pins or shoulder screws
  • Omni-directional (allowing air to come from any direction)
  • Low pressure drop (improving downstream velocity and temperature fields)
  • Overall height can be customized (without increasing cost)
  • RoHS compliant
  • Cost effective
S802-5000-279 Round Pin Heat Sink with Push Pins

Mechanical Drawing

Mechanical Drawing of Round Pin Heat Sink with Push Pins

Thermal Performance Curve

Thermal Performance of Round Pin Heat Sink with Push Pins

Mechanical and Thermal Specs

PropertyValueUnit
Width50.0mm
Length50.0mm
Height27.9mm
Weight32.8g
θSA (natural)3.47°C/W
θSA (200 LFM)1.14°C/W
θSA (400 LFM)0.80°C/W
θSA (600 LFM)0.69°C/W
θSA (800 LFM)0.62°C/W

Thermal Interface Material and Attachment Hardware

  • We recommend using spring-loaded push pins or shoulder screws to secure the heat sink to device.
  • We recommend Chomerics T725, T557 or Laird Tpcm 585 as interface materials.
What is the thermal resistance (θSA)?
Airflow rate:
What will be the base temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
What will be the junction temperature?
Heat to dissipate: W
Ambient temperature:
Airflow rate:
TIM impedance:
θjc: °C/W
* The computation is based on the interpolation of experimental or simulation data, and the result is for reference only.
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