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The Clear Lake Series
Round Pin Heat Sink with Push Pins
50 X 50 X 27.9 mm
Features and Benefits
- Designed for low- to medium-airflow environment (good for natural convection, limited airflow, fan failure, highly populated PCB, etc.)
- Forged from highly conductive pure aluminum (240 W/m-K)
- Secure attachment to PCB using push pins or shoulder screws
- Omni-directional (allowing air to come from any direction)
- Low pressure drop (improving downstream velocity and temperature fields)
- Overall height can be customized (without increasing cost)
- RoHS compliant
- Cost effective
Mechanical Drawing
Thermal Performance Curve
Mechanical and Thermal Specifications
| Property | Value | Unit |
|---|---|---|
| Width | 50.0 | mm |
| Length | 50.0 | mm |
| Height | 27.9 | mm |
| Weight | 32.8 | g |
| θSA (natural) | 3.47 | °C/W |
| θSA (200 LFM) | 1.14 | °C/W |
| θSA (400 LFM) | 0.80 | °C/W |
| θSA (600 LFM) | 0.69 | °C/W |
| θSA (800 LFM) | 0.62 | °C/W |
Thermal Interface Material and Attachment Method
- We recommend using spring-loaded push pins or shoulder screws to secure the heat sink to device.
- We recommend Chomerics T725, T557 or Laird Tpcm 585 as interface materials.
What is the thermal resistance (θSA)?
What will be the base temperature?
What will be the junction temperature?